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Material Specifications for standard printing at CNF

Substrates Specifications

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@ 780 nm	Fused Silica Substrates	ITO-Coated Substrates	Silicon Substrates	Borosilicate Substrates	Microscope Slides
Material	Fused Silica	Soda Lime w/ ITO	Si Substrates	Borosilicate Sub	Microscope Slides
Sample Holder	DiLL	DiLL	DiLL	10 × Ø 30 mm	DiLL
Refractive index	1.454	1.624 [ITO] 1.518 [soda lime]	3.710	1.517	1.518
Dimension	[25, 25, 0.7] mm	[25, 25, 0.7] mm	[25, 25, 0.725] mm	30 mm Ø, 170 µm	[22, 75, 1] mm
Thickness variation	± 25 µm	± 60 µm	± 25 µm	± 10 µm	± 100 µm
Surface finish	DSP	DSP	Polished	DSP	DSP
Density	2.2 g/cm3	2.5 g/cm3	2.3290 g/cm3
Mohs hardness	5.3-6.5	5-6	9-10
Melting point	1400°C	1000°C	3265°C
Thermal expansion coefficient	0.54x10-6 K-1	0.937 W/m·K	2.6 µm/(m·K)
Heat conductivity	1.38 W/(m·K)	0.937 W/(m·K)	149 W/(m·K)
Compatible w/ Solution Set	3D SF	3D MF (3D SF, 2D ML)	3D LF (3D MF, 3D SF, 2D ML)	3D SF Oil	3D SF
Compatible w/ 2PP resin	IP-DIP	IP-S	IP-Q (IP-S, IP-Dip, AZ resin)	IP-L 780 or IP-G 780	None, unless coated
Compatible w/ Objective	63X	20x, 25x , 63x	10x, (20x, 25x, 63x)	63x	63x
Combination & Ref index	-0.058 @ 20°C IP-Dip / -0.025 @ 20°C IP-S	-0.145 @ 20°C
Contrast
Cleaning & Prep	O2-plasma & silanization	O2-plasma & silanization	RC1

Indium-Tin Oxide (ITO) Coating Specifications:

ITO	Value
Film Thickness	18 nm ± 5 nm
Film Surface Resistance	100 - 300 Ω
Film Transmittance	≥89%

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Printing on wafers prepared by other systems or prints that require multiple objectives may require special alignment procedures to ensure the print occurs in the exact orientation desired. A detailed description of the exact alignment procedure is available on Nanoguide. To aid with this, three job files have been prepared to aid in aligning the 10X, 25X, and 63X objectives. All files by default print a single voxel width X for orientation purposes using the Write command. An example of this is below:

-10    -10    0 10    10    0 write -10    10    0 10    -10    0 write

This will produce an X that is 20 um wide by 20 um tall. This command can also be run in the Advanced → Commands window directly without a special job file.

Basic job files have been prepared for the 25X and 63X objectives for marker alignment:

25x_marker_job.gwl

63x_marker_job.gwl(File upload TK)

Applications

• Microfluidics
• Micromechanics
• Biomedical Engineering
• Micro-electro-mechanical systems
• Mechanical metamaterials
• Micro-optics
• Photonic metamaterials and Plasmonics

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